Hermetic Electronic Components – production helium leak testing of small sealed devices such as electronic components can be challenging. Often, small sealed electronics and other hermetically sealed devices require fine leak testing to ensure seal integrity. A leak rate sensitivity in the range of 10-5 to 10-8 atmcc/sec is very common for product performance which demands that helium leak testing be used versus alternative tracer gases and methods.
When helium leak testing these small sealed parts, helium must be introduced somehow, into the part in order to perform the leak test. This can be done during the assembly process or after assembly by a technique known as helium bombing. A bombing chamber can be used to inject helium into small, sealed devices in preparation for helium leak testing. The bombing method is commonly used when it is impractical to inject the helium tracer gas into the part during assembly.
To learn more about how LACO is helping customers leak test hermetically sealed components, check out our customer projects below.
To contact LACO directly, use our Contact form or contact us at 800-465-1004.
